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Title: Effects of the strain transmission from the main board to the installed electronic components
Authors: Kovtun, І.
Boiko, J.
Petrashchuk, S.
Baurienė, G.
Pilkauskas, K.
Ковтун, Ігор Іванович
Бойко, Юлій Миколайович
Петращук, Світлана Анатоліївна
Keywords: strain;deformation;pure bending;warpage;main board;electronic component
Issue Date: 2016
Publisher: Kaunas university of technology
Citation: Effects of the strain transmission from the main board to the installed electronic components / I. Kovtun, J. Boiko, S. Petrashchuk, G. Baurienė, K. Pilkauskas // Mechanika. – 2016. – Vol. 22, Iss. 6. – P. 489-494.
Abstract: The paper presents research of mechanical strain in printed circuit board functional assemblies, which are parts of electronic packages in modern machines and mechanisms. The strain is caused by external impacts that occur in manufacturing and exploitation conditions. The paper studies effects of the strain transmission from the main board to the installed electronic components, such as integrated circuits, discrete components, adapters, sockets, connectors, electronic modules etc.: mount stress in electronic components; strain effect of electronic component installation technologies; strain effect of integrated circuit installation technology; the influence of the main board load duration on the strain in mounted electronic modules; the strain in contact pads produced by bending of the main board. Acceptable limit specification method for main board warpage is developed.
Description: Optimization of electronic assembly pins quantity minimizes mount stress effect on electronic components. Developed high through-hole installation technology of electronic components on the main board provides significant reducing of the strain transmitted to electronic components in comparison with standard low through-hole and surface-mount installation. The strain in integrated circuits mounted on the main board depends on rigidity and design of their pins. The offered soft installation technology 3-4 times reduces strain in comparison with the solid installation. Hollow electronic modules are more sensitive to main board deformation than the encapsulated ones. The strain in electronic modules changes depending on duration of the main board deformation they are installed on. The deformation produced by the main board onto contact pads (assumed to be weak links of the whole structure) in electronic modules is found to be dependent on connecting leads or pins, and decreasing their rigidity or applying compensators can significantly reduce the influence of the main board onto the electronic components. The measured strain in case of soft installation technology is 3-4 times lower than the strain in solid installation.The developed method for acceptable limit specification of PCB warpage is applicable for any design of electronic modules and any installation technology. For the more detailed research of the strain in electronic components, which are relatively small objects, the further research will be aimed at application acoustic emission method in order to develop methods for strength diagnostics and predicting possible breakages at the stage long before a fatal destruction in electronic packages.
ISSN: 1392-1207
metadata.dc.type: Стаття
Appears in Collections:Кафедра телекомунікацій та радіотехніки

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